Re:ASML EUV Lithography Machine Could Keep Moore’s Law on Track
by wtallis on Sunday July 30, 2023 @01:03AM
(#36927988)
R&D and tooling costs have grown enormously to bring new fab process nodes online, but the actual per-wafer costs of materials and operating expenses historically haven't been growing to the same alarming degree. But that's changing, as new nodes are increasingly relying on power-hungry tools with low throughput that wear out mask sets at an unprecedented rate. It's not implausible for the industry to reach a point where new leading-edge processes will never mature to the point that they make economic sense for the low-cost applications that currently stay a few nodes behind the leading edge.
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Re:ASML EUV Lithography Machine Could Keep Moore’s Law on Track
by viscanti on Sunday July 30, 2023 @09:17AM
(#36930881)
The problem here would be that if mask sets wear out at an unprecedented rate, it might not make sense to use these cutting edge nodes in the future (if/when we're several nodes ahead by then) for the things that currently use older nodes. Maybe Moore's law is dead for the types of things that stay 2 or 3 nodes behind state of the art all the time.