Re:The First Room-Temperature Ambient-Pressure Superconductor
by zamalek on Wednesday July 26, 2023 @12:25PM
(#36880346)
I totally missed the impact of the internet, you are absolutely correct. Something else that I just noticed buried in the paper is that it can be readily deposited onto a substrate (search for UNIVAC in the paper, page 4). That's an incredibly big deal.
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Re:The First Room-Temperature Ambient-Pressure Superconductor
by louthy on Wednesday July 26, 2023 @04:54PM
(#36884889)
For the idiots in the room (me), could you explain why that’s a big deal? Does that make the material more robust and therefore usable in harsher environments?
Re:The First Room-Temperature Ambient-Pressure Superconductor
by zamalek on Thursday July 27, 2023 @02:03AM
(#36889514)
We can deposit it on chips, there is lots of copper (relatively speaking) in a chip so this could improve efficiency. Of course the semiconductor (silicon) is intentionally resistive, so waste+heat wouldn't go away entirely.