Re:The future of computers: 3D chip stacking
by tcas on Wednesday March 07, 2012 @12:29PM
(#3676223)
Xilinx's Vertex 7 FPGA uses a stacked design for the interconnects. The FPGA logic is all 28nm, but sitting under it is a completely passive 65nm interconnect layer.
http://www.xilinx.com/products/technology/stacked-silicon-in...