> These would use one or two "Zen 4" chiplets with stacked 3D Vertical Cache memory. A large amount of cache memory operating at the same speed as the on-die L3 cache, is made contiguous with it and stacked on top of the region of the CCD (chiplet) that has the L3 cache, while the region with the CPU cores has structural silicon that conveys heat to the surface
Source: https://www.techpowerup.com/301721/amd-readies-16-core-12-co...
Not from the benchmarks I've seen. Most games, perhaps.
The reason they didn't do it in the right order to start with is that the top die cannot be designed to work both with and without the cache. They can only start stacking the cache below the cpu once they accept that every single product will have a stacked cache.