Re:The big automotive semiconductor problem
by JRKrause on Thursday March 31, 2022 @10:30AM
(#30867619)
One method of making a chip 'tougher' is to physically increase the size of the semiconductor elements (e.g. transistors, FETs). This would seem incompatible with highly-integrated ICs.
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Re:The big automotive semiconductor problem
by xyzzy21 on Thursday March 31, 2022 @06:30PM
(#30872945)
This is true. For radiation hardening for space, this is exactly what is required for anything more harsh than LEO. And as a consequence, the generation of processors and memory typically used are 10-20 years behind the current state of the art. That's simply the price of reliability in harsh environments!