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A comment on Intel financialized and lost leadership in semiconductor fabrication (2021). Parent comment

Re:Intel financialized and lost leadership in semiconductor ... by sp332 on Thursday March 17, 2022 @07:40PM (#30717069)
Inside the CPU package, between the actual chips and the integrated heat spreader. If I didn't explain it well: https://www.dvhardware.net/article70404.html
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Re:Intel financialized and lost leadership in semiconductor ... by raverbashing on Friday March 18, 2022 @02:30AM (#30719234)
Yes and as the article says:

> Intel has also long preached the perils of solder TIM, which can lead to shorter lifespans due to microcracks in the solder TIM that form during heat-induced expansion and contraction.

It's not just about "cheaper solution". Yes, solder will be best for an overclock but that's not the primary objective here.

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Re:Intel financialized and lost leadership in semiconductor ... by gotaquestion on Thursday March 17, 2022 @07:42PM (#30717080)
Ohhh.. Got it. Thanks! Wow, that IS a problem.
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