I think you have no idea what entails what you are talking about. The world of semi has moved enormously since eighties, when the only country outside of USA with serious chip industry was Japan. Aside from "end of the pipe" fabs, and fab owners, everything else moved out, or never ever been a thing in USA.

US semiconductor equipment from LAM, and Applied Materials are more than half imported parts. US semi industry never used OSATs, until it had to ship their chips to Asia for that, and thus missed out on most of new packaging, and test tech which evolved outside of the US. Similarly for almost everything else.

Replacing Asian material suppliers for the US will be as hard as for China to develop a domestic photolithography stepper.