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Re:Why IBM Is Suing GlobalFoundries over Chip Roadmap Failures by anfilt on Monday June 14, 2021 @08:28PM (#27510033)
I would have to find it again but a while ago I was looking at thermal images of AMDs chipslets and the IO die is pretty cool compared to the chiplets for the cores. There probably is some power savings for using a newer node for the IO dies, but it would minor compared to the cores.

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