First, how do you cool such a chip? Sure, you could add a bunch of transistors but the thermal costs per transistor will stay the same. Assuming similar design but adding 20 layers, how would you account for your CPU now consuming 600W?

Second, The tech doesn't exist. The problem we have is that layering chips today is basically growing crystals in a controlled fashion. Defects in lower layers spoil upper layers. Today that's already a problem (CPUs today have ~7 or 8 layers). Can you imagine the problem of 20 or 30 layers?

Who knows, maybe we'll come up with solutions to both problems, but that's a big maybe. My bet is that instead we focus on architecture designs. We revisit old but deemed too expensive concepts like an async CPU.