Re:Intel 3rd gen Xeon Scalable (Ice Lake): generationally bi...
by bcrl on Tuesday April 06, 2021 @08:34PM
(#26719125)
In order to satisfy their wafer supply agreement with Global Foundries, AMD ships a GF fabbed I/O die in all their volume processors. I'm pretty sure that once they have met the terms required to exit that wafer supply agreement, we will see AMD shift that I/O die to a newer process with lower power draw.
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