News for hackers. Stuff that matters.
Re:Intel 3rd gen Xeon Scalable (Ice Lake): generationally bi... by bcrl on Tuesday April 06, 2021 @08:34PM (#26719125)
In order to satisfy their wafer supply agreement with Global Foundries, AMD ships a GF fabbed I/O die in all their volume processors. I'm pretty sure that once they have met the terms required to exit that wafer supply agreement, we will see AMD shift that I/O die to a newer process with lower power draw.

There are no comments on this comment yet.