Re:Japanese companies fight for share of EUV chip technology...
by totalZero on Monday January 25, 2021 @12:24AM
(#25899603)
It was a rhetorical question answered by the succeeding paragraph.
> Years long lead times. Every 200mm fab around is booked for at least 1y+ despite biggest increases in capacity in decades.
This is precisely my point. There is a need for more capacity.
Re:Japanese companies fight for share of EUV chip technology...
by donw on Sunday January 24, 2021 @08:39PM
(#25898082)
> Every 200mm fab
I know this is a typo, but that would explain the dimensional trend in smartphones...
Re:Japanese companies fight for share of EUV chip technology...
by sanxiyn on Sunday January 24, 2021 @09:17PM
(#25898322)
Not a typo. 200 mm refers to wafer size.
Re:Japanese companies fight for share of EUV chip technology...
by donw on Sunday January 24, 2021 @11:00PM
(#25898918)
Ah, that makes a lot more sense than a 200nm chip in 2021.
Still, I'm not going to get the image of a city-sized IC out of my head.
Re:Japanese companies fight for share of EUV chip technology...
by szatkus on Monday January 25, 2021 @12:32AM
(#25899654)
It's size of the wafer.
http://audilab.bmed.mcgill.ca/~funnell/InforMed/Bacon/HW/pri...
Years long lead times. Every 200mm fab around is booked for at least 1y+ despite biggest increases in capacity in decades.
A labs scale manufacturing can be setup within months, but it takes 3-4 years to setup AMHS fit fabs on a commercially profitable scale invariably of the technology level involved.