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A comment on NASA's Through-Hole Workmanship Req (2002). Parent comment

Re:NASA's Through-Hole Workmanship Req (2002) by moftz on Thursday December 17, 2020 @12:53PM (#25458103)
Use leaded solder and either inspect the joint for complete coverage or solder dip the part beforehand. Then, conformal coat the circuit card with sufficient thickness for tin whisker mitigation.

Conformal coat really is the saving grace for tin whiskers. It's not perfect, a whisker can push through sometimes but then the whisker has to push back through the conformal coat again which is much harder.

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Re:NASA's Through-Hole Workmanship Req (2002) by environment on Thursday December 17, 2020 @04:03PM (#25460381)
Here is a picture that show how effective a solder dip can be https://nepp.nasa.gov/whisker/photos/pom/2004april.htm

About leaded solder and the environment: "Current alternatives are worse for the environment",page16 https://nepp.nasa.gov/whisker./reference/tech_papers/2011-ko...

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