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A comment on TSMC and Google push chipmaking boundaries with 3D 'stacking'. Parent comment

Re:TSMC and Google push chipmaking boundaries with 3D 'stack... by mschuster91 on Thursday November 26, 2020 @04:24AM (#25218327)
> If China wanted to put some into their ICBMs, they would've been just better off wiring a smartphone to the rocket.

Why am I reminded of the plot of Iron Sky 1?

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