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A comment on TSMC and Google push chipmaking boundaries with 3D 'stacking'. Parent comment

Re:TSMC and Google push chipmaking boundaries with 3D 'stack... by absolutelyrad on Thursday November 26, 2020 @04:03AM (#25218238)
> possibly up to a decade

Their optoelectronics/optics tech is getting to the state of the art in a short period by their pace of progress from the rumors that I heard.

I'd wager 3-4 years before they have EUV themselves while avoiding conflict supply chain. Not 10 years time as you say.

They got some of the best minds on the planet working, so I wouldn't think that they cannot achieve it rather quick.

Zeiss and ASML are going to have real competition soon.

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Re:TSMC and Google push chipmaking boundaries with 3D 'stack... by baybal2 on Thursday November 26, 2020 @05:13AM (#25218585)
> Zeiss and ASML are going to have real competition soon.

FYI: Zeiss itself been buying low-end stepper lens work from Chinese for at least a decade, or two.

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Re:TSMC and Google push chipmaking boundaries with 3D 'stack... by dharma1 on Thursday November 26, 2020 @04:40AM (#25218409)
could absolutely happen sooner. It is of high strategic importance to China - to their whole electronics industry, and the AI dominance race, which also depends on specialised chips.

State level AI dominance race is one of the main drivers of the US/China tech sanctions, I suspect

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