Re:The HP Nanoprocessor: a high-speed processor that can't e...
by egsmi on Friday September 04, 2020 @06:12PM
(#24379414)
Oh, I see. I completely misread that paragraph.
If the metal strip is on the top of the ceramic and grounded it makes sense that it would be for ESD protection. Especially as they likely did hand assembly of the PCBs.
For your other question, the visible metal trace on top of the IC package is a common thing with ceramic packages. I think the purpose was to ground the metal lid of the IC to protect against noise, static, etc.