Re:3D Printing Integrated Circuits: What's Possible Now and ...
by brennanpeterson on Wednesday August 12, 2020 @10:44AM
(#24132500)
The more common maskless route is laser direct write. That is capable to micron level dimensions, and multicolor variants have been proposed to allow submicron.
Ebeam direct write is capable to NM level features. Just slow.
Ebeam direct write is capable to NM level features. Just slow.
http://www.periodicstructures.com/
Has some neat papers on this.