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Re:Intel Lakefield deep dive: the first x86 hybrid CPU by wronglebowski on Thursday July 02, 2020 @12:57PM (#23715268)
Needing to manufacture and assemble several components in this fashion must be awful for yields. I'd imagine AMDs chiplet process is much more forgiving.
Re:Intel Lakefield deep dive: the first x86 hybrid CPU by jagger27 on Thursday July 02, 2020 @02:45PM (#23716575)
This type of design seems very unforgiving to defects. I think the only place they can get away with a bad core is in the GPU portion.

Mind you it’s pretty small at 82mm^2.