Another approach I haven’t seen from either Intel or AMD yet, is to copy ARM’s big.LITTLE architecture: to set up separate “AVX2 cores” that can execute AVX instructions and most basic ALU ops but not e.g. branches, put those on the other side of the die with in-wafer thermal insulation between them and the regular cores; and then throw workloads between regular and AVX2 cores in a way where the AVX2 cores heating up doesn’t mean that the non-AVX2 cores are heating up, and the CPU can go back to full Turbo Boost as soon as the workload is thrown back to the regular cores, because the respective regular core is actually quite cool.

(The performance effects of this are possible to loosely estimate, I think, by writing code that synchronously sets up a GPGPU pass on some data, executes it, retrieves the result, and then returns to executing CPU instructions for a while, in a loop; and then executing this code on an Intel CPU using its on-die IGPU as the GPU. The CPU and IGPU form somewhat-separate thermal domains already, though there’s no explicit insulation.)