How? Did you mean to remove all the existing solder, reapply the paste, and reflow again (can that even be done on an already populated board, where do you place the mask/stencil?), or it's something else?
Getting a proper solders for QFN's really does best with a proper metal stencil. If you use JCL PCB, use their "electropolishing" option otherwise on fine pins the paste sticks more.
Removing and reflowing the part is tricky and often damages the part. Also to not ruin other parts of the board, a heat gun is often easier. We've never really tried reflowing parts unless a board didn't "bake" properly.
Yes, stencil is what I meant to say. The "mask" part of solder mask seems to throw me everytime I mean to say stencil, as in I want to mask the parts of the board _not_ to solder. Someways I wish English were more like Swiss/German or Hebrew.