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A comment on Cloud TPU Pods Break AI Training Records. Parent comment

Re:Cloud TPU Pods Break AI Training Records by rrss on Saturday July 13, 2019 @04:28PM (#20429967)
> would be suprised how hard it is to get funding from them to develop it.

That's probably because there has been no evidence that wafer scale integration can actually work.

[ Parent | on HN ]
Re:Cloud TPU Pods Break AI Training Records by morphle on Saturday July 13, 2019 @08:44PM (#20430983)
I agree there is no complete evidence of a full WSI yet. There are several recent papers on Wafer Scale Integration (WSI) and some WSI built (large sensors) with reasonable yields. There are many papers on partial problem solutions that, if combined in one project would yield a full working WSI with existing 7nm standard CMOS process. There are silicon interconnect fabric (SiIF) which is one step removed from a full WSI. There are many commercial chips 1/70th the size of a WSI already and some unpublished WSI results.
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