I worked for a huge company with their own manufacturing in China. We did a beta run of a product and they used some black market components for a TI regulator. When we got the boards the output was dead on the regulator so we sent it to TI. They x-rayed the part and it was just an empty plastic package.

Did you have a pretty good idea that this was the case before sending them to TI? Hardware design fascinates me and I'm just curious how something like this goes down.

We actually thought it was a problem with TI's parts, which is why we sent it to TI (we had a dedicated TI rep that came by every 2-3 weeks). When it came back that the package was empty it was actually a little embarrassing for us, since everyone immediately knew they were fakes. A bunch of calls went out and eventually one of the manufacturing managers tracked down the purchasing guy in the factory that said something like, "Oh this was a small run and I didn't want to buy a whole reel so I just ran down to the corner electronics market and picked up a 100."

The package pins start as one piece copper stamping (called leadframe) in order to ease handling and to guarantee correct alignment of the pins. The short between all the pins gets removed pretyy late in the packaging process when the die is actually mounted on to the leadframe.

Even Apple was forced to deal with glued fake plastic capacitors. iMac times, “Oral History of Arthur “Art” Astrin”, wifi pioneer: https://youtu.be/Tj5NNxVwNwQ?t=1h34m

They may be dummy components specifically designed for testing board manufacturing processes, without using (more expensive) real parts with die in them.