I wish it were so. While it is straightforward to do regular placement at the block level or even at the individual LUT/slice level using RPMs (relationally placed macros) or absolute LOC placement of LUTs in the XDC implementation constraints file, most of the implementation time goes into routing and there is not an easy mainstream way to take a routed one tile design and step and repeat it (say) 210 times across the die. In part this is due to non homogeneity across the columns and sometimes rows of the chip.

That makes sense. Thanks.

If you floor plan it yourself you can make the tool's job a lot easier. You can create a grid of regions on the FPGA and assign a core to each.