Re:What $50 buys you at the Huaqiangbei electronics market i...
by jdietrich on Friday October 14, 2016 @12:17AM
(#12706112)
These repair stencils are also used for reballing BGA components.
A brand new BGA chip has hundreds of solder balls underneath, acting like the pins on a DIP package. When the component is reworked, the balls are damaged and need to be replaced. After removing the old balls, the stencil can be used to apply solder paste and new solder balls to the chip. Once the chip is reballed, it can be reflowed onto the board.
A brand new BGA chip has hundreds of solder balls underneath, acting like the pins on a DIP package. When the component is reworked, the balls are damaged and need to be replaced. After removing the old balls, the stencil can be used to apply solder paste and new solder balls to the chip. Once the chip is reballed, it can be reflowed onto the board.
https://www.youtube.com/watch?v=0C80O7_galU