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Re:Intel Skylake Launch, with Architecture Analysis by cfallin on Wednesday September 02, 2015 @11:54AM (#10160075)
I'm nowhere near an expert in this, but I've heard that electromigration in the really thin wires can cause wearout over time. I imagine that this is probably near-negligible in the micrometer-sized interconnect layers in the 286 but a non-negligible issue in 14nm.

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